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芯片破解 破解芯片 飞思卡尔单片机 芯片特征介绍及解密

时间 : 2020-03-21 12:17 浏览量 : 22

飞思卡尔单片机 芯片特征介绍及解密

飞思卡尔单片机 芯片特征介绍及解密

dsp560芯片解密是我们在飞思卡尔系列ic解密研究中的一个典型解密实例,为方便需求者能够更好的理解单片机加解密原理,这里我们提供对dsp560单片机的基本性能特征介绍,供客户及工程师参考借鉴。

?speed

thedsp560isamemberofmotorola’sfamilyofhcmos,low-power,generalpurposedigitalsignalprocessors.thedsp560features512wordsoffullspeed,on-chipprogramram(pram)memory,two256worddatarams,twopreprogrammeddataroms,andspecialon-chipbootstraphardwaretopermitconvenientloadingofuserprogramsintotheprogramram.itisanoff-the-shelfpartsincetheprogrammemoryisuserprogrammable.thecoreoftheprocessorconsistsofthreeexecutionunitsoperatinginparallel—thedataalu,theaddressgenerationunit,andtheprogramcontroller.thedsp560hasmcu-styleon-chipperipherals,programanddatamemory,aswellasamemoryexpansionport.thempu-styleprogrammingmodelandinstructionsetmakewritingefficient,compactcode,straightforward.thehighthroughputofthedsp560makesitwellsuitedforcommunication,high-speedcontrol,numericprocessing,computerandaudioapplications.

at15millioninstructionspersecond(mips)witha33mhzclock,thedsp560canexecutea14pointcomplexfastfouriertransformin98milliseconds(66,240clockcycles).

thedatapathsare24bitswidetherebyproviding144dbofdynamicrange;intermediateresultsheldinthe56-bitaccumulatorscanrangeover336db.

thedataalu,addressarithmeticunits,andprogramcontrolleroperateinparallelsothataninstructionprefetch,a24x24-bitmultiplication,a56-bitaddition,twodatamoves,andtwoaddresspointerupdatesusingoneofthreetypesofarithmetic(linear,modulo,orreversecarry)canbeexecutedinasingleinstructioncycle.thisparallelismallowsafourcoefficientinfiniteimpulseresponse(iir)filtersectiontobeexecutedinonlyfourcycles,thetheoreticalminimumforasinglemultiplierarchitecture.

?integration

inadditiontothethreeindependentexecutionunits,thedsp560hassixon-chipmemories,threeon-chipmcustyleperipherals(serialcommunicationinterface,synchronousserialinterface,andhostinterface),aclockgeneratorandsevenbuses(threeaddressandfourdata),makingtheoverallsystemfunctionallycompleteandpowerful,butalsoverylowcost,lowpower,and

?invisiblepipeline

thethree-stageinstructionpipelineisessentiallyinvisibletotheprogrammerthusallowingstraightforwardprogramdevelopmentineitherassemblylanguageorahigh-levellanguagesuchasansic.

?instructionset

the62instructionmnemonicsaremcu-likemakingthetransitionfromprogrammingmicroprocessorstoprogrammingthedsp560digitalsignalprocessoraseasyaspossible.theorthogonalsyntaxsupportscontroloftheparallelexecutionunits.thissyntaxprovides12,8,830differentinstructionvariationsusingthe62instructionmnemonics.theno-overheaddoinstructionandtherepeat(rep)instructionmakewritingstraight-linecodeobsolete.

?dsp56000/dsp560

thedsp560isidenticaltothedsp56000exceptthatithas512x24-bitsofon-chipprogramraminsteadof75kofprogramrom;a32x24-bitbootstrapromforloadingtheprogramramfromeitherabyte-widememorymappedromorviathehostinterface;andtheon-chipxandydataromshavebeenpreprogrammedaspositivemu-anda-lawtolinearexpansiontablesandafull,fourquadrantsinewavetable,respectively.

?lowpower

asacmospart,thedsp560isinherentlyverylowpower;however,threeotherfeaturescanreducepowerconsumptiontoanexceptionallylowlevel.

—thewaitinstructionshutsofftheclockinthecentralprocessorportionofthedsp560.

—thestopinstructionhaltstheinternaloscillator.

—powerincreaseslinearly(approximately)withfrequency;thus,reducingtheclockfrequencyreducespowerconsumption

基于dsp560单片机的以上特点,芯片解密中心能在短时间内为您完成dsp560芯片解密等疑难型单片机解密服务。如果您有dsp560单片机解密或其他freescale芯片解密需求,欢迎来电来访咨询洽谈。

工程部服务热线:0755-29558766

(1对syncmos,winbond单片机,将把要烧录的文件转成hex文件,这样烧录到芯片内部的程序空位自动添00,如果你习惯bin文件,也可以用编程器把空白区域中的ff改成00,这样一般解密器也就找不到芯片中的空位,也就无法执行以后的解密操作。解密芯片,设计方法无需大改动有如下理由。在目前,生产工艺所改善的是布线电阻和布线电容,这些从使用铝布线及sio2层间绝缘膜之后,设计时都做了准确的预测,因此,在0.25~0.18mm时代,也可预测符合材料铜的布线电阻和布线电容,从而可以充分发挥布线应有的性能。c:芯片上面logo是一种型号,但实际上是另一种型号,加密者做了迷惑的手脚。但上面出现的概率都很低,而且是专业性的问题,,如果我们发现,会告知客户,如果客户还愿意做,我们继续做;如果不愿意,我们将退还客户所有定金和母片。

注释:0表示低电平;1表示高电平。使用中使能端ë接地有效。如左图所示,vdd和vss是数字控制输入(a0,a1,ë)的供电连接端,供电vdd对vss的电压差范围在3--15v之间,模拟输入/输出信号(y0--y3,z)电压处在上限vdd和下限vee之间,vdd-vee电压差不能超过15v,一般vee和vss相连接,一起接地。当前,面向0.13mm的低介电常数层间绝缘膜的后备者有:介电常数比约2的多孔结构的sio2;6~8的mps(Methyl-polysiloxane)及pae(polyaryleneether);8~1的hsq(hydrogensilsesquioxane)等。这些低介电常数层间绝缘膜有四个难题提高机械强度;提高可加工性;提高粘合性;降低吸水性。

研芯科技专业芯片解密12年,业内客户评价高,拥有功能强大的解密平台,目前已经服务上万家企业,PCB抄板单片机解密帮助客户新产品快速上市,抄板解密收费合理,用心的服务;不成功不收费! 芯片破解,破解芯片

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